Materials machined with thirty years machining experience include Silicon, Silicon Carbide, Glass, Gallium Arsenide, Lithium Niobate and Lithium Tantalate, Lead Zirconate Titanate (PZT), Sapphire.
Subcontract processes offered include dicing, grinding, thinning, drilling, milling slotting, chamfering, profilling and local area polishing all with post-process cleaning and to the latest 300mm diameter industry standard.
Work pieces handled include wafers, substrates, plates, laminates,
rods, blocks, tubes and assemblies.
Machining can be temperature controlled, and standard coolant exchanged for deionised 16 meg-ohm water with full or partial reionisation. |
